Expertise – Know How
When standard products are not enough, it is time to contact us. Our technical team can evaluate the needs and suggest an improved composition following a work methodology:
- Identify the presence of foreign chemical agents to the alloy.
- Evaluate the influence of impurities on the morphology and size of the intermetallic.
- Analyze the union between solder and substrate.
- Observe the morphology of the intermetallic layer (IMC). This is fundamental for the mechanixal resistance of the solder.
On the other hand, a metallographic analysis of white metal samples enables us to:
- Identify the presence of foreign chemical agents to the alloy.
- Observe the size and morphology of the copper needles and the appeareance or not of antimony cuboids.
We have a long experience in designing metallographic experiments to solve application defects. For this reason we can offer our customers the possibility of analyzing the microstructure of their solder bath samples. The metallographic analysis will give us a perfect picture of how the different phases that make up the alloy are related, this is, the spatial distribution of the intermetallic crystals in the matrix.
