In our laboratory we have spark spectrometer analysis with which we determine the exact composition of the materials. All the equipment complies with specific stantadads and it is certified by the manufacturers.

We have also incorporated an optical microscope which enables the control of the alloy microstructure. The solder depends on the mechanical properties of the microstructure , so its microscopic analysis anticipates problems or defect allowing us to act in advance.


Wave composition analysis is essential to control the quality of the joints. Due to the soldering process itself, part of the substrate is incorporated into the liquid alloy modifying the its composition. Therefore, it is necessary to control regularly the bath composition in order to ajust it with the appropriate levelling alloys.

It is especially critical to control the Pb level to guarantee RoHS compliance, as well as the level of Cu, Ni or Ge to avoid modifications in the morphology of the alloy.

Customers who require this analysis, only have to obtain a bath sample, following specific instructions (see document), and send it to our laboratory (See address).

Once the analysis is completed, customers receive a report with the composition, clearly indicating those values that do not comply with specifications.

Contact us for any doubt or enquiry.


The combination of composition analysis (spark spectrometer) and metallographic analysis (optical mircroscope) can explain a great variety of problems in the final application of the alloys, as for example, bridging most common in the electronics sector or the appearance of spots on the surface of the white metal bearings.

We also provide customized solutions.